Thermal Engineering Technical Leader

Job posting may be removed earlier if the position is filled or if a sufficient number of applications are received.

The Component Quality and Technology Organization in Supply Chain Operations is a key hub of technical innovation in Cisco. Members of the organization have a broad scope of influence: interacting with Business Units, Product Operations, Manufacturing Operations, Planning and Fulfillment, Supplier Management and directly with Suppliers. In addition, members of the organization participate in industry consortia, conferences and collaborate with academia and other strategic partners. The organization focuses on evaluating and adopting new technologies to help Cisco leapfrog the competition in advanced algorithms and solutions to solve complex problems.

You will be part of a world class Component Quality and Technology Group and contribute to developing, road mapping and implementing advanced thermal solutions for Cisco's products. You will Investigate and develop innovative thermal cooling solutions for hardware systems in large scale. You will lead in the development of test plans and qualification requirements to ensure mechanical and manufacturing robustness of thermal cooling solutions (pumps, heat pipes, vapor chambers, heat sinks, cold plates etc.). You will Engage with external vendors including ODM and component vendors on design, test and production. You will Establish parameters for thermal design/testing, correlation of design/test results to model predictions. You will Collaborate with Cisco hardware design teams to develop roadmaps and risk analyses for future thermal solutions for ASIC/IC, Optics, Power and other components and systems. You will partner with several Cisco hardware design teams to improve specifications and qualification procedures.

• BS in Mechanical or Chemical Engineering
• 8 - 10 years of experience in design, simulation and testing of thermal solutions for electronic devices and systems
• 8+ years of experience in electronic device and system level air cooling technologies
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• Experience in mechanical design validation and testing for electronic assemblies
• Knowledge of integrated circuit packaging technologies (BGA, large body size Flip Chip BGA, 2.5D and 3D Packaging)
• Component and system reliability analysis

• 10+ years of relevant industry experience in microelectronics cooling
• Experience in developing liquid cooling solutions for electronic devices and systems.
• Experience with Thermal Interface Material Thermal Conductivity Testing procedures
• Experience with troubleshooting and thermal validation with data acquisition systems, airflow and environmental chambers
• Experience with liquid cooling (cold plates, CDUs, manifolds, piping, characterization, pumps etc.) and high-power air-cooling solutions, such as heat pipes, VCs, and 3D VCs.
• Ability to lead by influence without direct reporting chain and advise executive decision makers
• Self-starter, proven ability to work independently on multiple projects and priorities
• Excellent communication, project management and metrics design skills>

At Cisco, we're revolutionizing how data and infrastructure connect and protect organizations in the AI era - and beyond. We've been innovating fearlessly for 40 years to create solutions that power how humans and technology work together across the physical and digital worlds. These solutions provide customers with unparalleled security, visibility, and insights across the entire digital footprint. Simply put - we power the future.

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