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Senior Optical Packaging Engineer

PSI Quantum
$150,000-$200,000 USD
United States, California, Palo Alto
700 Hansen Way (Show on map)
Mar 19, 2025

Quantum computing holds the promise of humanity's mastery over the natural world, but only if we can build a real quantum computer. PsiQuantum is on a mission to build the first real, useful quantum computers, capable of delivering the world-changing applications that the technology has long promised. We know that means we will need to build a system with roughly 1 million qubits that supports fault tolerant error correction within a scalable architecture, and a data center footprint.

By harnessing the laws of quantum physics, quantum computers can provide exponential performance increases over today's most powerful supercomputers, offering the potential for extraordinary advances across a broad range of industries including climate, energy, healthcare, pharmaceuticals, finance, agriculture, transportation, materials design, and many more.

PsiQuantum has determined the fastest path to delivering a useful quantum computer, years earlier than the rest of the industry. Our architecture is based on silicon photonics which gives us the ability to produce our components at Tier-1 semiconductor fabs such as GlobalFoundries where we leverage high-volume semiconductor manufacturing processes, the same processes that are already producing billions of chips for telecom and consumer electronics applications. We also benefit from the quantum mechanics reality that photons don't feel heat or electromagnetic interference, allowing us to take advantage of existing cryogenic cooling systems and industry standard fiber connectivity.

In 2024, PsiQuantum announced two government-funded projects to support the build-out of our first Quantum Data Centers and utility-scale quantum computers in Brisbane, Australia and Chicago, Illinois. Both projects are backed by nations that understand quantum computing's potential impact and the need to scale this technology to unlock that potential. And we won't just be building the hardware, but also the fault tolerant quantum applications that will provide industry-transforming results.

Quantum computing is not just an evolution of the decades-old advancement in compute power. It provides the key to mastering our future, not merely discovering it. The potential is enormous, and we have the plan to make it real. Come join us.

There's much more work to be done and we are looking for exceptional talent to join us on this extraordinary journey!

Job Summary:

The Sr. Optical Packaging Engineer is responsible for developing & implementing a high-performance & robust fiber-to-chip package and a scalable packaging process for optical systems comprised of optical fibers attached to a variety of chip-based photonic integrated circuits.

Responsibilities:



  • Develop an optical package and fiber-to-chip alignment scheme that allows for high alignment accuracy and scalable assembly.
  • Help develop packaging prototypes & scalable fiber-to-chip packaging flows and processes, NPI.
  • Review packaging design BOMs, work with supply chain on procuring parts needed for assembly.
  • Establish and update version-controlled DFM requirements and feed back to packaging design group.
  • Work with manufacturing group and vendors on transferring & scaling packaging designs and processes based on successful prototypes.
  • Advise manufacturing group and vendors on setup of high-throughput packaging assembly lines.
  • Work with external vendors and suppliers to source required materials and provide feedback on evolving requirements.


Mandatory Experience/Qualifications:



  • Master's Degree or above in Engineering, Physics or Material Science.
  • 5+ years of experience with/at semiconductor company or supplier working on PIC packaging design, qualification & multi-chip assemblies.
  • 5+ years of experience working with optical fibers, optical measurements.
  • 5+ years of work experience with advanced semiconductor packaging OSAT (Outsourced Semiconductor Assembly & Test) and/or EOL vendors.
  • 5+ years of experience with semiconductor company or supplier working on FAU / optical connector to chip attachment.
  • Experience with fiber attach tooling & process/flow development and optical data analysis


Nice to have:



  • Experience with FA and 8D failure resolution techniques.
  • Experience with developing metrics for yield and quality management, including reliability and yield based on optical and mechanical performance.


PsiQuantum provides equal employment opportunity for all applicants and employees. PsiQuantum does not unlawfully discriminate on the basis of race, color, religion, sex (including pregnancy, childbirth, or related medical conditions), gender identity, gender expression, national origin, ancestry, citizenship, age, physical or mental disability, military or veteran status, marital status, domestic partner status, sexual orientation, genetic information, or any other basis protected by applicable laws.

Note: PsiQuantum will only reach out to you using an official PsiQuantum email address and will never ask you for bank account information as part of the interview process. Please report any suspicious activity to recruiting@psiquantum.com.

We are not accepting unsolicited resumes from employment agencies.

The range below reflects the minimum and maximum target range for new hire base salary across all US locations. Actual compensation may vary outside of this range and is dependent on various factors including but not limited to a candidate's qualifications including relevant education and training, competencies, experience, geographic location, and business needs. Base pay is only one part of the total compensation package. Full time roles are eligible for equity and benefits. Base pay is subject to change and may be modified in the future.

For a fully qualified candidate, the expected base pay range is:

Base Pay Range
$150,000 $200,000 USD
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